EQS-News: SUSS presents the XBC300 Gen2 D2W platform – the integrated and precise solution for the future of die-to-wafer hybrid bonding

• Highest precision: post-bond accuracy of < ±200 nm  
• Up to 40 percent space saving compared to other fully integrated D2W hybrid bonding products
• Bonder specialist SET contributes ultra-high-precision die bonder

Garching, May 26, 2025 – SUSS, a leading global supplier of equipment and process solutions for the semiconductor industry, today introduces the XBC300 Gen2 D2W platform – a customized bonding solution that completes the company's hybrid bonding portfolio. This new platform underscores SUSS' position as an industry leader in providing a fully integrated D2W hybrid bonding solution for demanding manufacturing requirements.

The new SUSS process solution enables die-to-wafer (D2W) bonding on 200mm and 300mm substrates and meets the most demanding inter-die spacing requirements. It is an ideal platform to produce high-precision chips thanks to industry-leading footprint savings of up to 40 percent and a post-bond accuracy of < ±200 nm. With the integrated platform, all process steps, in particular surface activation and die positioning, are carried out in a single, fully automated solution. The integration ensures greater cleanliness and improved process control compared to modular competitor solutions.  

“With our new XBC300 Gen2 D2W die-to-wafer platform, we have completed our hybrid bonding portfolio consisting of our high-performance wafer-to-wafer platform and our combined D2W/W2W solution,” explains Dr. Robert Wanninger, Senior Vice President Advanced Backend Solutions at SUSS. “Our unique equipment portfolio now allows us to offer our customers efficient solutions for different manufacturing requirements from a single source and to benefit from the high expected market growth in hybrid bonding.”

D2W bonding is an advanced semiconductor manufacturing process that precisely dielectrically and metallically bonds individual chips together on wafers to create highly precise, stable and conductive tracks. The new SUSS platform is ideal for 3D IC technologies for efficient processing of multiple die layers on top of each other, for example in high-bandwidth memory (HBM) applications.

“Our XBC300 Gen2 D2W hybrid bonding platform offers yield-optimized performance, especially in the production of stacked dies. It enables us to make production efficient and reliable by using only known good dies,” says Markus Ruff, Head of Product Line Bonding at SUSS.

The XBC300 Gen2 D2W platform, which is already available for customer demonstrations at the Application Center in Sternenfels, Germany, was developed in close collaboration with SET Corporation SA, a leading specialist in flip-chip bonders. The integration of SET's ultra-precision die bonder into the SUSS platform creates a powerful, fully integrated platform that meets the needs of the industry in research, development and high-volume manufacturing.  

More information about the XBC300 Gen2 D2W: https://www.suss.com/en/products-solutions/wafer-bonder/xbc300-gen2-d2w  

 
Media contact  
Sven Köpsel  
Vice President Investor Relations & Communications  
E-mail: sven.koepsel@suss.com  
Phone: +49 89 320 07 151   

About SUSS  
SUSS is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS contributes to the advancement of next-generation technologies such as 3D integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service SUSS supports more than 8,000 installed systems worldwide, making it a reliable partner for the semiconductor industry. SUSS is headquartered in Garching near Munich, Germany. The shares of SUSS MicroTec SE are traded in the Prime Standard of the German Stock Exchange (ISIN DE000A10K0235). For more information, please visit suss.com.